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product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/25 tsz02201-0g7g0an00550-1-2 ? 2016 rohm co., ltd. all rights reserved. 20.apr.2016 rev.001 tsz22111 14 001 www.rohm.com voltage tracker 250 ma output voltage tracker bd42530xxx-c series general description the bd42530xxx-c series are low quiescent voltage trackers featuring 45 v absolute maximum voltage, and output voltage tracking accuracy of 10 mv, 250 ma output current and 40 a (typ) current consumption. these trackers are theref ore ideal for applications requiring a direct connection to the battery and a low current consumption. ceramic capacitors can be used for compensation of the output capacitor phase. furthermore, these ics also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions. packages w (typ) x d (typ) x h (max) efj: htsop-j8 4.90 mm x 6.00 mm x 1.00 mm features aec-q100 qualified (note 1) qualified for automotive applications wide temperature range (tj): -40 c to +150 c wide operating input range: 3 v to 42 v low quiescent current: 40 a (typ) output voltage tracking accuracy: 10 mv over current protection (ocp) thermal shutdown protection (tsd) (note 1: grade 1) fp2: to263-5 10.16 mm x 15.10 mm x 4.70 mm applications automotive (engine-ecu, body, air-conditioner etc.) typical application circuits components externally connected: 1 f c in , 10 f c o (min) electrolytic, tantalum and ceramic capacitors can be used. datashee t downloaded from: http:///
datasheet d a t a s h e e t 2/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 ordering information b d 4 2 5 3 0 e f j c e2 part number package efj htsop-j8 fp2 to263-5 c: for automotive packaging and forming specification e2: embossed tape and reel lineup output current package orderable part number 250 ma htsop-j8 reel of 2500 bd42530efj-ce2 to263-5 reel of 500 BD42530FP2-Ce2 downloaded from: http:///
datasheet d a t a s h e e t 3/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 pin configurations pin descriptions htsop-j8 (note 1), (note 2), (note 3) to263-5 (note 1), (note 2) pin no. pin name function pin no. pin name function 1 vo output 1 vcc input 2 n.c. not connected 2 n.c. not connected 3 n.c. not connected 3 gnd ground 4 n.c. not connected 4 adj / en output control voltage 5 adj / en output control voltage 5 vo output 6 gnd ground fin gnd ground 7 n.c. not connected 8 vcc input note 1: n.c. pin is recommended to short with gnd. note 2: n.c. pin can be open because it isnt connect it inside of ic. note 3: exposed die pad is need to be connected to gnd. 1 2 3 4 8 7 6 5 htsop-j8 (top view) to263-5 (top view) 1 2 3 4 5 fin downloaded from: http:///
datasheet d a t a s h e e t 4/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 block diagrams htsop-j8 to263-5 vcc (1pin) n.c. (2pin) gnd (3pin) vo (5pin) t adj / en (4pin) g gnd (fin) am downloaded from: http:///
datasheet d a t a s h e e t 5/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 description of blocks block name function description of blocks prereg internal power supply power supply for internal circuit. tsd thermal shutdown protection the tsd protect the devic e from overheating. if the chip temperature (tj) reaches ca. 175 c (typ), the output is turned off. ocp over current protection the ocp protect the device from damage caused by over current. amp output power transistor driver amplifier the amplifier drives output power transistor with adj/en voltage as reference voltage. power tr. output power transistor pdmos type output power transistor. downloaded from: http:///
datasheet d a t a s h e e t 6/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 absolute maximum ratings parameter symbol ratings unit supply voltage (note 1) v cc -0.3 to +45 v output control voltage v adj / en -0.3 to +28 v output voltage v o -0.3 to +28 v junction temperature range tj -40 to +150 c storage temperature range ts t g -55 to +150 c maximum junction temperature tjmax +150 c power dissipation htsop-j8 (note 2) pd 0.96 w to263-5 (note 3) 1.54 esd withstand voltage hbm (note 4) v esd, hbm 2000 v cdm (note 5) v esd, cdm 1000 v (note 1) do not exceed junction temperature. (note 2) reduced by 7.69 mw / c over ta = 25 c, when mounted on glass epoxy board : 114.3 mm x 76.2 mm x 1.57 mm. (note 3) reduced by 12.35 mw / c over ta = 25 c, w hen mounted on glass epoxy board : 114.3 mm x 76.2 mm x 1.57 mm. (note 4) human body model (note 5) charged device model (caution) exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in da mages to or destruction of the chip. in this event it also becomes impossible to de termine the cause of the damage (e .g. short circuit, open circuit, etc.). therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, im plementing physical safety mea sures, such as adding fuses, should be considered. operating conditions (-40 c tj +150 c) parameter symbol min max unit supply voltage (note 1) v cc 5.6 42 v tracking voltage (note 2) v adj / en 2 16 v start-up voltage (note 3) v cc 3 v output current i o 0 250 ma ambient temperature range ta - 4 0 125 c (note 1) v adj/en = 5v, i o = 200ma. (note 2) v adj/en vcc C 0.5v. (note 3) i o = 0 ma. downloaded from: http:///
datasheet d a t a s h e e t 7/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 thermal impedance (note 1) parameter symbol typ. unit conditions htsop-j8 junction to ambient ja 130 c / w 1s (note 2) 34 c / w 2s2p (note 3) junction to top center of case (note 4) jt 15 c / w 1s (note 2) 7 c / w 2s2p (note 3) to263-5 junction to ambient ja 81 c / w 1s (2) 21 c / w 2s2p (3) junction to top center of case (note 4) jt 8 c / w 1s (2) 2 c / w 2s2p (3) (note 1) the thermal impedance is based on jesd51 - 2a (still - air) standard. (note 2) jesd51 - 3 standard fr4 114.3 mm x 76.2 mm x 1.57 mm 1 - layer (1s) (top copper foil: rohm recommended foot print + wiring to measure, 2 oz. copper.) (note 3) jesd51 - 5 / - 7 standard fr4 114. 3 mm x 76.2 mm x 1.60 mm 4 - layer (2s2p) (top copper foil: rohm recommended footprint + wiring to measure / 2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm x 74.2 mm, copper (top & reverse side / inner layers) 2oz. / 1oz.) (note 4) t t : top center of cases (mold) temperature. downloaded from: http:///
datasheet d a t a s h e e t 8/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 electrical characteristics (unless otherwise specified, -40 c tj +150 c, v cc = 13.5 v, v adj / en = 5 v, i o = 0 ma. the typical value is defined at tj = 25 c.) parameter symbol limit unit conditions min typ max circuit current i cc - 40 80 a io 250 ma output voltage tracking accuracy ? v o -10 - 10 mv 3.5v vcc 32v, 0.1 ma i o 100 ma v adj / en = 2v -10 - 10 mv 3.8v vcc 32v, 0.1 ma i o 250 ma v adj / en = 2v -10 - 10 mv 6v vcc 32v, 0.1 ma i o 250 ma v adj / en = 5v dropout voltage ? vd - 0.28 0.60 v v cc = v o 0.95 (= 4.75 v: typ), i o = 200 ma ripple rejection r.r. - 80 - db f = 120 hz, ein = 1 vrms, i o = 100 ma thermal shut down tsd - 175 - c tj at tsd on electrical characteristics (output control function) (unless otherwise specified, -40 c tj +150 c, v cc = 13.5 v, io = 0 ma. the typical value is defined at tj = 25 c.) parameter symbol limit unit conditions min typ max shutdown current ishut - 1 5 a v adj / en 0.4 v tj 125 c adj / en on mode voltage vthh 2 - - v active mode adj / en off mode voltage vthl 0 - 0.4 v off mode adj / en bias current i adj / en - 1 3 a v adj / en =5 v downloaded from: http:///
datasheet d a t a s h e e t 9/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 0 10 20 30 40 50 60 70 80 0 50 100 150 200 250 circuit current : icc[ua] output current : io[ma] tj=150 tj=25 tj=-40 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 45 circuit current : icc[ua] power supply voltage : vcc[v] tj=150 tj=25 tj=-40 -5 -4 -3 -2 -1 0 1 2 3 4 5 0 50 100 150 200 250 tracking accuracy : ? vo[mv] output current : io[ma] tj=150 tj=25 tj=-40 -5 -4 -3 -2 -1 0 1 2 3 4 5 0 5 10 15 20 25 30 35 40 45 tracking accuracy : ? vo[mv] power supply voltage : vcc[v] tj=150 tj=25 tj=-40 typical performance curves unless otherwise specified: -40 c tj +150 c, v cc = 13.5 v, v adj/en = 5 v, io = 0 ma. figure 1. tracking accuracy vs. power supply voltage figure 2. tracking accuracy vs. output current figure 3. circuit current vs. power supply voltag e figure 4. circuit current vs. output current downloaded from: http:///
datasheet d a t a s h e e t 10/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 0 20 40 60 80 100 120 100 1000 10000 100000 ripple rejection : r.r.[db] frequency : f[hz] tj=150 tj=25 tj=-40 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage : vo[v] power supply voltage : vcc[v] tj=150 tj=25 tj=-40 0 1 2 3 4 5 6 012345 output voltage : vo[v] power supply voltage : vcc[v] tj=150 tj=25 tj=-40 0 100 200 300 400 500 600 0 50 100 150 200 250 dropout voltage : ? vd[mv] output current : io[ma] tj=150 tj=25 tj=-40 typical performance curves unless otherwise specified: -40 c tj +150 c, v cc = 13.5 v, v adj/en = 5 v, io = 0 ma. figure 5. output voltage vs. power supply voltage figure 6. output voltage vs. power supply voltage at low supply voltage figure 7. dropout voltage vs. output current (vcc=4.75v) figure 8. ripple rejection vs. frequency (ein=1vrms, io=100ma) downloaded from: http:///
datasheet d a t a s h e e t 11/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 0 1 2 3 4 5 6 100 120 140 160 180 200 output voltage : vo[v] junction temperarure : tj[ ] 0 1 2 3 4 5 6 0 200 400 600 800 1000 output voltage : vo[v] output current : io[ma] tj=150 tj=25 tj=-40 0 10 20 30 40 50 60 70 80 -40 0 40 80 120 160 circuit current : icc[ua] junction temperarure : tj[ ] -5 -4 -3 -2 -1 0 1 2 3 4 5 -40 10 60 110 160 tracking accuracy : ? vo[mv] junction temperarure : tj[ ] typical performance curves unless otherwise specified: -40 c tj +150 c, v cc = 13.5 v, v adj/en = 5 v, io = 0 ma. figure 9. tracking accuracy vs. junction temperature (io=50ma) figure 10. circuit current vs. junction temperature figure 11. output voltage vs. output current (over current protection) figure 12. output voltage vs. junction temperature (thermal shut down) downloaded from: http:///
datasheet d a t a s h e e t 12/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 012345 adj/en bias current : iadj/en[ a] adj/en supply voltage : vadj/en[v] tj=150 tj=25 tj=-40 0 1 2 3 4 5 6 012345 output voltage : vo[v] adj/en supply voltage : vadj/en[v] tj=150 tj=25 tj=-40 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 -40 10 60 110 160 shut down current : ishut[ a] junction temperarure : tj[ ] 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 5 10 15 20 25 30 35 40 45 shut down current : ishut[ a] power supply voltage : vcc[v] tj=150 tj=25 tj=-40 typical performance curves unless otherwise specified: -40 c tj +150 c, v cc = 13.5 v, v adj/en = 5 v, io = 0 ma. figure 13. shut down current vs. power supply voltage figure 14. shut down current vs. junction temperature figure 15. adj/en bias current vs. adj/en supply voltage figure 16. output voltage vs. adj/en supply voltage downloaded from: http:///
datasheet d a t a s h e e t 13/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 1f 10f bd42530efj-c 8:vcc 7:n.c. 6:gnd 5:adj / en 1:vo 2:n.c. 3:n.c. 4:n.c. v io 1f 10f bd42530efj-c 8:vcc 7:n.c. 6:gnd 5:adj / en 1:vo 2:n.c. 3:n.c. 4:n.c. v a 1f 10f bd42530efj-c 8:vcc 7:n.c. 6:gnd 5:adj / en 1:vo 2:n.c. 3:n.c. 4:n.c. v measurement circuit measurement setup for figure 1, 3, 10 measurement setup for figure 2, 9 measurement setup for figure 4 measurement setup for figure 5, 6, 12 measurement setup for figure 7 measurement setup for figure 8 measurement setup for figure 11 measurement setup for figure 13, 14 measurement setup for figure 15, 16 downloaded from: http:///
datasheet d a t a s h e e t 14/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 1 10 100 1000 0 50 100 150 200 250 output capacitor: co [f] output current: io [ma] 0.001 0.01 0.1 1 10 100 0 50 100 150 200 250 output capacitor esr: co_esr [ ? ] output current: io [ma] selection of components externally connected ? vcc pin insert capacitors with a capacitance of 1 f (min) or higher between the vcc and gnd. choose the capacitance according to the line between the power smoothing circuit and the vcc. selection of t he capacitance also depends on the application. verify the application and allow suffi cient margins in the design. we recommend to mount the capacitor as close as possible to the pin. when select ing the capacitor ensure that the capacitance of 1 f or higher is maintained at the intended applie d voltage and temperature range. ? output pin capacitor in order to prevent oscillation, a capacitor needs to be placed between t he output pin and gnd. we recommend using a capacitor with a capacitance of 10 f (min) or higher. electrolytic, tant alum and ceramic capacitors can be used. when selecting the capacitor ensure that the capacitance of 10 f or higher is maintained at the intended applied voltage and temperature range. capacitance fluctuation due to changes in temperature can possibly result in oscillation. for selection of the capac itor refer to the data of figure 18. the stable operation range given in the data of figure 17 is based on the standalone ic and resistive load. for actual applications the stable operating range is influenced by the pcb impedance, input supply impedance and load impedance. therefore verification of t he final operating environment is needed. when selecting a ceramic type capacitor, we recommend us ing x5r, x7r or better with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load cu rrent, select the capacitance in accordance with verifying that the actual application m eets with the required specif ication. mount the capacitor as close as possible to the connected pin. figure 17. output pin capacitor esr vs output current figure 18. output pin capacitor vs output current figure 19. measurement setups for esr reference data condition 5.6v vcc 42v 2v v adj/en 16v v adj/en < vcc c in = 1 f 10 f c o 100 f -40c tj +150c condition 5.6v vcc 42v 2v v adj/en 16v v adj/en < vcc c in = 1f -40c tj +150c stable operation range unstable operation range stable operation range unstable operation range downloaded from: http:///
datasheet d a t a s h e e t 15/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 0.96 w 3.67 w 0.0 1.0 2.0 3.0 4.0 5.0 0 25 50 75 100 125 150 power dissipation: pd[w] ambient temperature: ta [c] 1.54 w 5.95 w 0.0 2.0 4.0 6.0 8.0 10.0 0 25 50 75 100 125 150 power dissipation: pd[w] ambient temperature: ta [c] power dissipation htsop-j8 ic mounted on rohm standard board based on jedec. : 1 - layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) board material: fr4 board size: 114.3 mm x 76.2 mm x 1.57 mm mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended footprint + wiring to measure, 2 oz. copper. : 4 - layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm x 74.2 mm) board material: fr4 board size: 114.3 mm x 76.2 mm x 1.60 mm mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of pcb : 74.2 mm x 74.2 mm, 1 oz. copper. copper foil area on the reverse side of pcb : 74.2 mm x 74.2 mm, 2 oz. copper. condition : ja = 130 c / w, jt (top center) = 15 c / w condition : ja = 34 c / w, jt (top center) = 7 c / w to263-5 ic mounted on rohm standard board based on jedec. : 1 - layer pcb (copper foil area on the reverse side of pcb: 0 mm x 0 mm) board material: fr4 board size: 114.3 mm x 76.2 mm x 1.57 mm mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended footprint + wiring to measure, 2 oz. copper. : 4 - layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm x 74.2 mm) board material: fr4 board size: 114.3 mm x 76.2 mm x 1.60 mm mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of pcb : 74.2 mm x 74.2 mm, 1 oz. copper. copper foil area on the reverse side of pcb : 74.2 mm x 74.2 mm, 2 oz. copper. condition : ja = 81 c / w, jt (top center) = 8 c / w condition : ja = 21 c / w, jt (top center) = 2 c / w figure 20. htsop-j8 package data figure 21. to263-5 package data downloaded from: http:///
datasheet d a t a s h e e t 16/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 thermal design within this product, the power consumption is decided by the dropout voltage condition, the load current and the circuit current. refer to package data illustrated in figure 20, 21 when using the ic in an environment of ta 25 c. even if the ambient temperature ta is at 25 c, depending on the input vo ltage and the load current, chip junction temperature can be very high. consider the design to be tj tjmax = 150 c in all possible operating temperature range. on the reverse side of the package (htsop-j8, to263-5) there is expose d heat pad for improving the heat dissipation. should by any condition the maximum junction temperature tjmax = 150 c rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. the therma l impedance in this specification is based on recommended pcb and measurement condition by jedec standard. verify the application and allow sufficient margins in the thermal design by the following method is used to calculate the junction temperature tj. tj can be calculated by either of the two following methods. 1. the following method is used to calculate the junction temperature tj. tj ta p c ja where: tj : junction temperature ta : ambient temperature p c : power consumption ja : thermal impedance (junction to ambient) 2. the following method is also used to calculate the junction temperature tj. tj t t p c jt where: tj : junction temperature t t : top center of cases (mold) temperature p c : power consumption jt : thermal impedance (junction to top center of case) the following method is used to calculate the power consumption pc (w). pc v cc \ v o i o v cc i cc where: p c : power consumption v cc : input voltage v o : output voltage i o : load current i cc : circuit current downloaded from: http:///
datasheet d a t a s h e e t 17/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 ? calculation example (htsop-j8) if v cc = 13.5 v, v o = 5.0 v, i o = 50 ma, i cc = 40 a, the power consumption pc can be calculated as follows: p c v cc \ v o i o v cc i cc . v C . v ma . v a . w at the ambient temperature tamax = 85c, the thermal impedance (junction to ambient) ja = 34 c / w (4-layer pcb), tj tamax p c ja c . w c / w . c when operating the ic, the top cent er of cases (mold) temperature t t = 100 c, jt = 15 c / w (1-layer pcb), tj t t p c jt c . w c / w . c for optimum thermal performance, it is recommended to expand the copper foil area of the boar d, increasing the layer and thermal via between thermal land pad. downloaded from: http:///
datasheet d a t a s h e e t 18/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 application examples ? applying positive surge to the vcc if the possibility exists that surges higher than 45 v will be applied to the vcc, a zener diode should be placed between the vcc and gnd as shown in the figure below. ? applying negative surge to the vcc if the possibility exists that negative su rges lower than the gnd are applied to t he vcc, a shottky diode should be place between the vcc and gnd as shown in the figure below. ? implementing a protection diode if the possibility exists that a large inductive load is connec ted to the output pin resulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. ? reverse polarity protection diode in some applications, the vcc and pin potential might be reve rsed, possibly resulting in dama ge to internal circuit or damage to the element. in instance, when vcc shorts to gnd while external capacitor at vo is charged. reverse current in case of point a described in below diagram can be prevented by inserting reverse polarity protection diode in series to the vcc. when a short of the point b and the gnd is concerned afte r having reverse polarity protection diode inserted, we recommend inserting a bypass diode between the vcc and the vo. if the reverse polarity protection diode and bypass diode cannot be inserted due to any reason s, use a capacitor with a capacitance with less than 1000 f at v adj / en = 5v and 100 f at v adj / en = 16v to avoid damage to the internal circuits or the elements. vcc vo gnd downloaded from: http:///
datasheet d a t a s h e e t 19/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 i/o equivalence circuits 1 vcc 2 adj/en 3 vo downloaded from: http:///
datasheet d a t a s h e e t 20/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effe ct of temperature and aging on the ca pacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature rati ng be exceeded the rise in te mperature of the chip may result in deterioration of the properti es of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceedin g the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, powe r wiring, width of ground wiring, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage fr om static discharge, ground the ic during a ssembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. unused input terminals input pins of an ic are often connec ted to the gate of a mos transistor. t he gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outsi de can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction th rough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
datasheet d a t a s h e e t 21/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 operational notes C continued 11. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lowe r than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ics maximum junction temperature rating. if ho wever the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the ts d circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. downloaded from: http:///
datasheet d a t a s h e e t 22/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 physical dimension, tape and reel information (htsop-j8) package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t 23/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 physical dimension, tape and reel information (to263-5) package name to263-5 downloaded from: http:///
datasheet d a t a s h e e t 24/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 marking diagrams (top view) part number package part number marking bd42530efj-c htsop-j8 42530 BD42530FP2-C to263-5 bd42530 htsop-j8 1pin mark lot number part number marking to263-5 part number marking lot number 1pin downloaded from: http:///
datasheet d a t a s h e e t 25/25 bd42530xxx-c series ? 2016 rohm co., ltd. all rights reserved. tsz22111 15 001 www.rohm.com tsz02201-0g7g0an00550-1-2 20.apr.2016 rev.001 revision history date revision changes 20.apr.2016 001 new release downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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